1" Copper Backing Plate - EQ-CBP-1
Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.
SPECIFICATION
SPECIFICATION
| Chemical Symbol | Copper |
| Thickness | 2.3 mm |
| Weight | 1 oz |
| Color | Reddish Brown |
| Application Notes | Used for bonding with nonmetallic sputtering targets. |
| Operation Instructions |   |
Product Information
Product Information
Shipping & Returns
Shipping & Returns
1" Copper Backing Plate - EQ-CBP-1
1" Copper Backing Plate - EQ-CBP-1
Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.
SPECIFICATION
SPECIFICATION
| Chemical Symbol | Copper |
| Thickness | 2.3 mm |
| Weight | 1 oz |
| Color | Reddish Brown |
| Application Notes | Used for bonding with nonmetallic sputtering targets. |
| Operation Instructions | |
$180.00
1" Copper Backing Plate - EQ-CBP-1—
$180.00
Product Information
Product Information
Shipping & Returns
Shipping & Returns
Description
Copper Backing Plate is used for improving the conductivity of the nonmetallic plasma sputtering targets.
SPECIFICATION
SPECIFICATION
| Chemical Symbol | Copper |
| Thickness | 2.3 mm |
| Weight | 1 oz |
| Color | Reddish Brown |
| Application Notes | Used for bonding with nonmetallic sputtering targets. |
| Operation Instructions | |
