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Ge Wafer (100) +/- 2.5 Degree Undoped, 2" dia x 0.5 mm, 1SP, Resistivities: >50 ohm-cm

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Ge Wafer (100) +/- 2.5 Degree Undoped, 2" dia x 0.5 mm, 1SP, Resistivities: >50 ohm-cm

Ge Wafer (100) +/- 2.5 Degree Undoped, 2" dia x 0.5 mm, 1SP, Resistivities: >50 ohm-cm

Ge Wafer Specification

  • Growing Method:                CZ
  • Orientation:                        (100) +/-2.5 Deg.
  • Wafer Size:                        2" dia x  500 microns  
  • Surface Polishing:              one side epi polished
  • Surface roughness:             RMS or Ra: ~ 10 A ( by AFM)
  • Doping:                              Undoped
  • Conductor type:                  N-type
  • Resistivity:                          >50 Ohms/cm (If you would like to measure the resistivity accurately, 
                                             please order our
     Portable 4 Probe Resistivity Testing Instrument.)                    
  • Package:                           under 1000 class clean room      

Typical Properties:

  • Structure:                         Cubic, a = 5.6754 A
  • Density:                            5.323 g/cm3 at room temperature
  • Melting Point:                    937.4 oC
  • Thermal Conductivity:         640

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$589.00
Ge Wafer (100) +/- 2.5 Degree Undoped, 2" dia x 0.5 mm, 1SP, Resistivities: >50 ohm-cm
$589.00

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Description

Ge Wafer Specification

  • Growing Method:                CZ
  • Orientation:                        (100) +/-2.5 Deg.
  • Wafer Size:                        2" dia x  500 microns  
  • Surface Polishing:              one side epi polished
  • Surface roughness:             RMS or Ra: ~ 10 A ( by AFM)
  • Doping:                              Undoped
  • Conductor type:                  N-type
  • Resistivity:                          >50 Ohms/cm (If you would like to measure the resistivity accurately, 
                                             please order our
     Portable 4 Probe Resistivity Testing Instrument.)                    
  • Package:                           under 1000 class clean room      

Typical Properties:

  • Structure:                         Cubic, a = 5.6754 A
  • Density:                            5.323 g/cm3 at room temperature
  • Melting Point:                    937.4 oC
  • Thermal Conductivity:         640

Related Product

Other Crystal wafer A-Z

Plasma Cleaner

 Wafer Containers

Dicing saw

Film Coater

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