Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD

SPECIFICATIONS

Features	Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3, and LiTaO3 Wafer The cutting pressure is adjustable by the spring Cutting size: 100 x100 mm (4 x 4") 200 x200 mm (8 x 8'') 300 x300 mm (12 x 12'') Max. The cutting thickness for single-crystal substrate: 1 mm Made in Japan
Cutting Procedure	Adjust the height of the diamond scriber Tuning the pressure of the spring Placing the substrate Scribing Splitting the substrate
Replace Diamond Scriber	Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0 Move the slide unit to the diamond scriber replacement position and remove the guide rod Turn the handle over 90 degrees to the left Loosen the screw by using the hex wrench and remove the diamond scriber Install the new diamond scriber and tighten the screw Return the handle to the scribing position and set the guide rod
Product Dimensions	SYJ-DS100: 210 mm (L) x 210 mm (W) x 140 mm (H) SYJ-DS200: 310 mm (L) x 310 mm (W) x 140 mm (H) SYJ-DS300: 410 mm (L) x 410 mm (W) x 140 mm (H)
Diamond cutting knife	One diamond knife is included with a dimension 13 mm (L) x 26 mm (W) x 5 mm (H) Please click the picture let to order a replacement
The thickness of the Cutting Wheel	0.65mm
Compliance	No UL is required because no electric
Warranty	One-year limited warranty with lifetime support
Operational video
Application Notes	The minimum size of the substrate is at least twice the thickness. Generally, it is 5 mm x 5 mm. Replace the diamond scriber when dull To avoid the spring being degraded, turn the spring pressure dial to the initial position of 0 after use For long-term use, wipe the slitting unit guide rod periodically and put grease

Product Information

Shipping & Returns

Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD

SPECIFICATIONS

Features	Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3, and LiTaO3 Wafer The cutting pressure is adjustable by the spring Cutting size: 100 x100 mm (4 x 4") 200 x200 mm (8 x 8'') 300 x300 mm (12 x 12'') Max. The cutting thickness for single-crystal substrate: 1 mm Made in Japan
Cutting Procedure	Adjust the height of the diamond scriber Tuning the pressure of the spring Placing the substrate Scribing Splitting the substrate
Replace Diamond Scriber	Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0 Move the slide unit to the diamond scriber replacement position and remove the guide rod Turn the handle over 90 degrees to the left Loosen the screw by using the hex wrench and remove the diamond scriber Install the new diamond scriber and tighten the screw Return the handle to the scribing position and set the guide rod
Product Dimensions	SYJ-DS100: 210 mm (L) x 210 mm (W) x 140 mm (H) SYJ-DS200: 310 mm (L) x 310 mm (W) x 140 mm (H) SYJ-DS300: 410 mm (L) x 410 mm (W) x 140 mm (H)
Diamond cutting knife	One diamond knife is included with a dimension 13 mm (L) x 26 mm (W) x 5 mm (H) Please click the picture let to order a replacement
The thickness of the Cutting Wheel	0.65mm
Compliance	No UL is required because no electric
Warranty	One-year limited warranty with lifetime support
Operational video
Application Notes	The minimum size of the substrate is at least twice the thickness. Generally, it is 5 mm x 5 mm. Replace the diamond scriber when dull To avoid the spring being degraded, turn the spring pressure dial to the initial position of 0 after use For long-term use, wipe the slitting unit guide rod periodically and put grease

Select Cutting Size

From $1,698.00

Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD—

$1,698.00

Select Cutting Size

From $1,698.00

Precision Manual Diamond Wafer Scriber for Wafer Optional 4" - 12" - SYJ-DS100-LD—

$1,698.00

Product Information

Shipping & Returns

Description

SPECIFICATIONS

Features	Diamond Scriber for cutting the thin single crystal substrate such as Silicon, Sapphire, Ge, LiNbO3, and LiTaO3 Wafer The cutting pressure is adjustable by the spring Cutting size: 100 x100 mm (4 x 4") 200 x200 mm (8 x 8'') 300 x300 mm (12 x 12'') Max. The cutting thickness for single-crystal substrate: 1 mm Made in Japan
Cutting Procedure	Adjust the height of the diamond scriber Tuning the pressure of the spring Placing the substrate Scribing Splitting the substrate
Replace Diamond Scriber	Rotate the diamond scriber height adjustment dial and the spring pressure adjustment dial to the original point of 0 Move the slide unit to the diamond scriber replacement position and remove the guide rod Turn the handle over 90 degrees to the left Loosen the screw by using the hex wrench and remove the diamond scriber Install the new diamond scriber and tighten the screw Return the handle to the scribing position and set the guide rod
Product Dimensions	SYJ-DS100: 210 mm (L) x 210 mm (W) x 140 mm (H) SYJ-DS200: 310 mm (L) x 310 mm (W) x 140 mm (H) SYJ-DS300: 410 mm (L) x 410 mm (W) x 140 mm (H)
Diamond cutting knife	One diamond knife is included with a dimension 13 mm (L) x 26 mm (W) x 5 mm (H) Please click the picture let to order a replacement
The thickness of the Cutting Wheel	0.65mm
Compliance	No UL is required because no electric
Warranty	One-year limited warranty with lifetime support
Operational video
Application Notes	The minimum size of the substrate is at least twice the thickness. Generally, it is 5 mm x 5 mm. Replace the diamond scriber when dull To avoid the spring being degraded, turn the spring pressure dial to the initial position of 0 after use For long-term use, wipe the slitting unit guide rod periodically and put grease